Toshiba Electronic Devices (TDED) manufactures discrete semiconductors and ICs primarily in Japan at Kitakyushu and Kaga fabs. Japan-origin Toshiba products face 0% MFN + 10% Section 122 = 10% total. No Section 301 applies.
Toshiba Electronic Devices is headquartered in Japan, but most components are manufactured in Japan, Malaysia. For US customs purposes, the COO is where the component is manufactured — not where the company is based. Declaring Japan as COO when parts ship from Japan is a customs violation.
| Country | Sec 122 | Sec 301 | Total |
|---|---|---|---|
| Japan | 10% | — | 10% |
| Malaysia | 10% | — | 10% |
* Section 301 rates shown for electronics HTS chapters (8541–8542). Rates vary by product.
| HTS Code | Description |
|---|---|
| 8541.21.0090 | MOSFETs and IGBTs (TK, SSH series) |
| 8542.39.0000 | Motor driver ICs (TB6 series) |
| 8541.40.0000 | Photocouplers (TLP series) |
| 8504.40.9550 | Power converter ICs |
Toshiba Electronic Devices & Storage Corporation (TDSC, operating brand TDED) is a separate entity from Toshiba Corporation, majority-owned by Toshiba Corp. It manufactures power MOSFETs, IGBTs, small-signal transistors, diodes, photocouplers, and motor driver ICs. Primary wafer fabs are in Kitakyushu and Kaga, Japan. Assembly and test occurs in Malaysia. Japan-origin TDED products: 0% MFN + 10% Section 122 = 10% effective. MOSFETs under HTS 8541.21 from Japan: 10% total. Photocouplers (TLP series) under HTS 8541.40 from Japan: 10% total.
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