Texas Instruments is headquartered in Dallas but manufactures the majority of its components in the Philippines, Malaysia, and Thailand — not the USA. TI's analog ICs, op-amps, data converters, and microcontrollers assembled in the Philippines or Malaysia face only the 10% Section 122 surcharge.
Texas Instruments is headquartered in United States, but most components are manufactured in Philippines, Malaysia, Thailand, China. For US customs purposes, the COO is where the component is manufactured — not where the company is based. Declaring United States as COO when parts ship from Philippines is a customs violation.
Analog ICs, DSPs, microcontrollers — assembly & test
Assembly and test
Assembly and test
Assembly and test + some fab
| Country | Sec 122 | Sec 301 | Total |
|---|---|---|---|
| Philippines | 10% | — | 10% |
| Malaysia | 10% | — | 10% |
| Thailand | 10% | — | 10% |
| China | 10% | 50% | 60% |
* Section 301 rates shown for electronics HTS chapters (8541–8542). Rates vary by product.
| HTS Code | Description |
|---|---|
| 8542.31.0000 | DSPs and microcontrollers (MSP430, TMS320) |
| 8542.39.0000 | Analog ICs, op-amps, data converters |
| 8541.29.0000 | Power semiconductors |
Texas Instruments operates one of the most diversified manufacturing networks among major semiconductor companies, with wafer fabrication in the US (Dallas, Sherman TX, South Portland ME, Aizu Japan) and back-end assembly concentrated in the Philippines (Baguio and Cagayan de Oro), Malaysia (Kuala Lumpur and Melaka), Thailand (Bangkok), and China (Chengdu and Shanghai). The Philippines is TI's single largest assembly and test location by volume, handling the majority of analog ICs, operational amplifiers, data converters, and MSP430 microcontrollers. For US customs, COO is determined by where substantial transformation occurs — for TI parts, this is the assembly and test location, not the US wafer fab.
Texas Instruments products span multiple HTS chapters. DSPs and microcontrollers (MSP430, TMS320 families) classify under 8542.31.0000. Analog ICs including op-amps (OPA, TLV series), instrumentation amplifiers (INA series), data converters (ADS, DAC series), and interface ICs classify under 8542.39.0000. Power semiconductors and gate drivers fall under 8541.29.0000. For Philippines, Malaysia, and Thailand COO, the applicable rate is 10% (Section 122 only, no Section 301). For China-assembled TI parts (some Chengdu-sourced items), the rate climbs to 60% (10% Section 122 + 50% Section 301). The vast majority of TI catalog parts have Philippines or Malaysia COO, which is the key compliance advantage for buyers.
TI's analog IC portfolio — covering more than 80,000 SKUs — is largely assembled in the Philippines, a country not subject to Section 301. This makes TI one of the more tariff-favorable large suppliers compared to manufacturers with heavier China back-end exposure. However, some legacy linear products acquired through acquisitions (National Semiconductor, Burr-Brown) may have different COO documentation. Importers should request TI's standard Certificate of Origin for all shipments and verify at the PO level rather than at the part family level, since production can shift between sites with minimal external notice.
TI's Chengdu facility primarily handles OSAT (outsourced semiconductor assembly and test) overflow and some commodity analog packaging. Parts shipped from Chengdu carry China COO and face the 60% rate. Sourcing engineers specifying TI parts for US-bound assemblies should confirm with distributors whether available stock originates from Philippines or China sites. At high volumes, a 60% versus 10% tariff differential on mid-range analog ICs priced at $0.50–$5.00 per unit can represent meaningful BOM cost variance. TI generally ships from Philippines as the default, but distributor-held inventory may have mixed COO depending on when it was acquired.
TI's automotive-grade devices (AECQ-100 qualified parts, AM series Sitara processors, SafeTI functional safety ICs) are primarily assembled in Malaysia and the Philippines. These parts face the 10% Section 122 rate, which is manageable for most automotive tier-1 BOM structures. The bigger concern for automotive supply chains is lead time: TI automotive parts typically require 26–52 week lead times through authorized distributors. The CHIPS Act has spurred TI to expand US domestic wafer capacity in Sherman, TX, but assembly and test will continue offshore for the foreseeable future, maintaining the Philippines/Malaysia COO for the majority of volume shipments.
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