NXP Semiconductors is headquartered in Eindhoven, Netherlands, but manufactures primarily in Malaysia, Thailand, and the Philippines. NXP is the world's largest automotive semiconductor supplier. Most NXP parts face only the 10% Section 122 surcharge.
NXP Semiconductors is headquartered in Netherlands, but most components are manufactured in Malaysia, Thailand, China, Philippines. For US customs purposes, the COO is where the component is manufactured — not where the company is based. Declaring Netherlands as COO when parts ship from Malaysia is a customs violation.
MCUs, automotive ICs — assembly & test
Assembly and test
Assembly and test
Assembly and test
| Country | Sec 122 | Sec 301 | Total |
|---|---|---|---|
| Malaysia | 10% | — | 10% |
| Thailand | 10% | — | 10% |
| China | 10% | 50% | 60% |
| Philippines | 10% | — | 10% |
* Section 301 rates shown for electronics HTS chapters (8541–8542). Rates vary by product.
| HTS Code | Description |
|---|---|
| 8542.31.0025 | i.MX, LPC, Kinetis microcontrollers |
| 8542.39.0000 | CAN/LIN transceivers, interface ICs |
| 8541.21.0090 | Small signal transistors, digital transistors |
NXP Semiconductors operates as a mixed IDM/fabless company. Front-end wafer fabrication occurs at NXP's own fabs in Nijmegen (Netherlands), Hamburg (Germany), and at TSMC/GlobalFoundries for advanced nodes. Back-end assembly and test — which determines COO for US customs — is concentrated in Malaysia (Kuala Lumpur and Seremban), Thailand (Bangkok area), and the Philippines (Cabuyao). China (Tianjin) handles some commodity assembly. Malaysia is the primary declared COO for the majority of NXP's volume products: i.MX application processors, LPC/Kinetis/MCX microcontrollers, S32 automotive MCUs, and CAN/LIN/FlexRay transceiver ICs. The Netherlands and Germany sites primarily ship wafer-level products or are not the final transformation step for customs purposes.
NXP's product lineup covers HTS 8542.31.0025 (i.MX, LPC, Kinetis, S32K microcontrollers and processors), 8542.39.0000 (CAN/LIN/FlexRay transceivers, interface ICs, power management), 8541.21.0090 (small signal transistors, digital logic transistors), and 8529.10.9040 (NFC/RFID transceiver ICs such as MIFARE and NTAG). For Malaysia, Thailand, and Philippines COO: 10% Section 122, no Section 301. For China-assembled NXP parts: approximately 60% (10% Section 122 + 50% Section 301). Automotive S32K parts are nearly exclusively assembled in Malaysia. i.MX RT crossover MCUs split between Malaysia and Philippines depending on variant. CAN transceiver TJA series is primarily Malaysia COO.
NXP is the world's largest automotive semiconductor supplier by revenue, with S32K MCUs in virtually every major vehicle platform globally, and CAN/LIN transceivers in nearly all automotive ECUs. For US automotive tier-1 suppliers importing NXP parts, the 10% Section 122 tariff is embedded in component cost structures. AEC-Q100 qualified NXP automotive parts (S32K, S32G, FS6500 safety PMIC) are assembled at Malaysia and Philippines sites with IATF-16949 certification — these are non-China COO and face the 10% rate exclusively. Buyers should verify this in NXP's COO documentation but should generally expect non-China declaration for automotive-grade parts.
NXP's i.MX 8, i.MX 9, and i.MX RT product families are widely used in industrial HMI, medical devices, automotive infotainment, and IoT gateways. The i.MX 8M series (fabricated at TSMC N12) and i.MX RT1060/1170 crossover MCUs are assembled and tested in Malaysia and the Philippines. At per-unit prices ranging from $5 (i.MX RT) to $40+ (i.MX 9), the 10% Section 122 duty adds $0.50–$4.00 per unit. For high-volume IoT deployments, this is relevant to landed cost budgeting. Lead times for i.MX 8M Plus have stabilized at 20–26 weeks; i.MX RT availability is generally better at 8–16 weeks from distributor stock.
NXP's MIFARE and NTAG NFC IC families dominate the contactless card and IoT tag market. These products are manufactured in Nijmegen (Netherlands) fab and assembled primarily in Thailand and Malaysia. Netherlands and Malaysia-origin NFC ICs both face the 10% Section 122 rate. For the security-focused SE050 and EdgeLock secure element line used in IoT authentication, Malaysia is the primary assembly location. Buyers implementing NFC in US-market products should include the 10% duty cost in BOM calculations but need not worry about the higher Section 301 exposure that would apply to China-COO alternatives.
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