HTS 8542.90 – Parts for Integrated Circuits & Electronic Microassemblies

HTS 8542.90 covers parts used in the manufacturing of integrated circuits — including BGA substrates, leadframes, die attach films, and encapsulation materials. The MFN rate is free. Japanese substrate makers (Ibiden, Shinko) and Taiwanese IC packaging houses (ASE, Amkor) face 10%. Chinese-sourced IC assembly materials face 60%. This category is critical for electronics importers purchasing IC packaging components, bare substrates, or semi-finished chip assemblies.